</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.50.80.90/Wafer Grinder for Dimensional Control/Japan

Wafer Grinder for Dimensional Control from Japan

Backside grinders thinning wafers to 50-100 micron specs for advanced packaging with stress relief. Classified HTS 8461.50.80.90 other machine tools for semiconductor wafer processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Tape frame compatibility specs prove semiconductor application

• ITAR/EAR classification for advanced node equipment