Wafer Grinder for Dimensional Control from Japan
Backside grinders thinning wafers to 50-100 micron specs for advanced packaging with stress relief. Classified HTS 8461.50.80.90 other machine tools for semiconductor wafer processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Tape frame compatibility specs prove semiconductor application
• ITAR/EAR classification for advanced node equipment