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8461.50.80.90/Wafer Grinder for Dimensional Control/Germany

Wafer Grinder for Dimensional Control from Germany

Backside grinders thinning wafers to 50-100 micron specs for advanced packaging with stress relief. Classified HTS 8461.50.80.90 other machine tools for semiconductor wafer processing.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Tape frame compatibility specs prove semiconductor application

• ITAR/EAR classification for advanced node equipment