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8461.50.80.90/Wafer Grinder for Dimensional Control/Canada

Wafer Grinder for Dimensional Control from Canada

Backside grinders thinning wafers to 50-100 micron specs for advanced packaging with stress relief. Classified HTS 8461.50.80.90 other machine tools for semiconductor wafer processing.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Tape frame compatibility specs prove semiconductor application

• ITAR/EAR classification for advanced node equipment