8461.50.80.90/Wafer Edge Grinder/Japan

Wafer Edge Grinder from Japan

Machine for grinding wafer edges post-slicing to precise tolerances and remove damage layers before polishing. HTS 8461.50.80.90 includes this semiconductor wafer preparation tool as other cutting-off/grinding by metal/cermet removal.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify removal rates and surface finish (Ra < 0.1 micron) in invoices

• Pair with boule/w afer lineage docs for consistent classification

Wafer Edge Grinder from Japan — Import Duty Rate | HTS 8461.50.80.90