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8461.50.80.90/Wafer Edge Grinder/Japan

Wafer Edge Grinder from Japan

Machine for grinding wafer edges post-slicing to precise tolerances and remove damage layers before polishing. HTS 8461.50.80.90 includes this semiconductor wafer preparation tool as other cutting-off/grinding by metal/cermet removal.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify removal rates and surface finish (Ra < 0.1 micron) in invoices

• Pair with boule/w afer lineage docs for consistent classification