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8461.50.80.90/Wafer Edge Grinder/Germany

Wafer Edge Grinder from Germany

Machine for grinding wafer edges post-slicing to precise tolerances and remove damage layers before polishing. HTS 8461.50.80.90 includes this semiconductor wafer preparation tool as other cutting-off/grinding by metal/cermet removal.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify removal rates and surface finish (Ra < 0.1 micron) in invoices

• Pair with boule/w afer lineage docs for consistent classification

Wafer Edge Grinder from Germany — Import Duty Rate | HTS 8461.50.80.90