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8461.50.80.90/Wafer Edge Grinder/Canada

Wafer Edge Grinder from Canada

Machine for grinding wafer edges post-slicing to precise tolerances and remove damage layers before polishing. HTS 8461.50.80.90 includes this semiconductor wafer preparation tool as other cutting-off/grinding by metal/cermet removal.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Specify removal rates and surface finish (Ra < 0.1 micron) in invoices

• Pair with boule/w afer lineage docs for consistent classification

Wafer Edge Grinder from Canada — Import Duty Rate | HTS 8461.50.80.90