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8461.50.80.90/Silicon Ingot Diameter Grinder/Mexico

Silicon Ingot Diameter Grinder from Mexico

Grinds silicon ingots to uniform diameter specification (150mm-450mm) for consistent wafer thickness post-growth. Classified HTS 8461.50.80.90 as other metal/cermet removing machine for semiconductor boule prep.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify diameter tolerance (±0.1mm) proving semiconductor precision

• Calibrate shipping declarations with statistical note examples

Silicon Ingot Diameter Grinder from Mexico — Import Duty Rate | HTS 8461.50.80.90