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8461.50.80.90/Silicon Ingot Diameter Grinder/Japan

Silicon Ingot Diameter Grinder from Japan

Grinds silicon ingots to uniform diameter specification (150mm-450mm) for consistent wafer thickness post-growth. Classified HTS 8461.50.80.90 as other metal/cermet removing machine for semiconductor boule prep.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify diameter tolerance (±0.1mm) proving semiconductor precision

• Calibrate shipping declarations with statistical note examples