</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.50.80.90/Semiconductor Wafer Slicing Saw/Japan

Semiconductor Wafer Slicing Saw from Japan

Diamond wire saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide. Classified in HTS 8461.50.80.90 as other sawing or cutting-off machines removing cermets in semiconductor manufacturing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Document wire diameter (<50 microns) and kerf loss specs for classification support

• Obtain advance rulings for saws with multi-material capability