Semiconductor Wafer Slicing Saw from Japan
Diamond wire saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide. Classified in HTS 8461.50.80.90 as other sawing or cutting-off machines removing cermets in semiconductor manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document wire diameter (<50 microns) and kerf loss specs for classification support
• Obtain advance rulings for saws with multi-material capability