Semiconductor Wafer Slicing Saw from Canada
Diamond wire saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide. Classified in HTS 8461.50.80.90 as other sawing or cutting-off machines removing cermets in semiconductor manufacturing.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document wire diameter (<50 microns) and kerf loss specs for classification support
• Obtain advance rulings for saws with multi-material capability