Gallium Arsenide Wafer Saw from Mexico
Precision cutting-off saw optimized for brittle GaAs boules into compound semiconductor wafers with minimal chipping. HTS 8461.50.80.90 covers sawing machines for cermet removal in statistical note materials.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Note material brittleness (Knoop <100) requires special handling declarations
• Use semiconductor end-user letters for duty mitigation
• Avoid generic saw descriptions to prevent consumer goods classification