8461.50.80.90/Gallium Arsenide Wafer Saw/Japan

Gallium Arsenide Wafer Saw from Japan

Precision cutting-off saw optimized for brittle GaAs boules into compound semiconductor wafers with minimal chipping. HTS 8461.50.80.90 covers sawing machines for cermet removal in statistical note materials.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Note material brittleness (Knoop <100) requires special handling declarations

• Use semiconductor end-user letters for duty mitigation

• Avoid generic saw descriptions to prevent consumer goods classification