Gallium Arsenide Wafer Saw from Germany
Precision cutting-off saw optimized for brittle GaAs boules into compound semiconductor wafers with minimal chipping. HTS 8461.50.80.90 covers sawing machines for cermet removal in statistical note materials.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Note material brittleness (Knoop <100) requires special handling declarations
• Use semiconductor end-user letters for duty mitigation
• Avoid generic saw descriptions to prevent consumer goods classification