Gallium Arsenide Wafer Saw from Canada
Precision cutting-off saw optimized for brittle GaAs boules into compound semiconductor wafers with minimal chipping. HTS 8461.50.80.90 covers sawing machines for cermet removal in statistical note materials.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Note material brittleness (Knoop <100) requires special handling declarations
• Use semiconductor end-user letters for duty mitigation
• Avoid generic saw descriptions to prevent consumer goods classification