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8461.50.80.90/Crystal Flat Grinding Machine/Japan

Crystal Flat Grinding Machine from Japan

Specialized grinder creating orientation flats on semiconductor boules to denote doping type and resistivity for wafer processing. Under HTS 8461.50.80.90 as other machine tools for shaping by cermet removal per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include resistivity correlation charts in technical docs

• Train staff on HTS statistical note language for CBP interactions