8461.50.80.90/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Precision grinder for semiconductor crystal boules, achieving exact diameter and flats for conductivity/resistivity indication before wafer slicing. HTS 8461.50.80.90 covers this as other machine tools for sawing/cutting-off by removing metal or cermets in wafer prep.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify flatness tolerance specs (<1 micron) to prove semiconductor application

• Use ISF filings early for high-value equipment to avoid penalties

Crystal Boule Grinder from Japan — Import Duty Rate | HTS 8461.50.80.90