Crystal Boule Grinder from Japan
Precision grinder for semiconductor crystal boules, achieving exact diameter and flats for conductivity/resistivity indication before wafer slicing. HTS 8461.50.80.90 covers this as other machine tools for sawing/cutting-off by removing metal or cermets in wafer prep.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify flatness tolerance specs (<1 micron) to prove semiconductor application
• Use ISF filings early for high-value equipment to avoid penalties