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8461.50.80.90/Boule Slicing Diamond Saw/Mexico

Boule Slicing Diamond Saw from Mexico

Inner diameter diamond saw for sectioning semiconductor boules into wafers with <25 micron thickness control. Other sawing machine under HTS 8461.50.80.90 removing cermets per Chapter 84 notes.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify diamond grit size (10-20 micron) and spindle RPM (>3000)

• Bonded carrier declarations for US fab customers