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8461.50.80.90/Boule Slicing Diamond Saw/Japan

Boule Slicing Diamond Saw from Japan

Inner diameter diamond saw for sectioning semiconductor boules into wafers with <25 micron thickness control. Other sawing machine under HTS 8461.50.80.90 removing cermets per Chapter 84 notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify diamond grit size (10-20 micron) and spindle RPM (>3000)

• Bonded carrier declarations for US fab customers

Boule Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8461.50.80.90