Boule Slicing Diamond Saw from Japan
Inner diameter diamond saw for sectioning semiconductor boules into wafers with <25 micron thickness control. Other sawing machine under HTS 8461.50.80.90 removing cermets per Chapter 84 notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond grit size (10-20 micron) and spindle RPM (>3000)
• Bonded carrier declarations for US fab customers