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8461.50.80.90/Boule Slicing Diamond Saw/Germany

Boule Slicing Diamond Saw from Germany

Inner diameter diamond saw for sectioning semiconductor boules into wafers with <25 micron thickness control. Other sawing machine under HTS 8461.50.80.90 removing cermets per Chapter 84 notes.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify diamond grit size (10-20 micron) and spindle RPM (>3000)

• Bonded carrier declarations for US fab customers

Boule Slicing Diamond Saw from Germany — Import Duty Rate | HTS 8461.50.80.90