Boule Slicing Diamond Saw from Canada
Inner diameter diamond saw for sectioning semiconductor boules into wafers with <25 micron thickness control. Other sawing machine under HTS 8461.50.80.90 removing cermets per Chapter 84 notes.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond grit size (10-20 micron) and spindle RPM (>3000)
• Bonded carrier declarations for US fab customers