NC Wafer Backside Grinder from Mexico
Numerically controlled grinder removing backside material from semiconductor wafers to achieve target thickness post-processing. Classified HTS 8461.50.4050 as NC machine tool for cermet removal in wafer preparation per statistical notes. Critical for stress relief and TTV control.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify grind wheel composition (diamond/CBN) and thickness control specs (micron-level)
• Include wafer handling systems documentation confirming semiconductor compatibility
• Verify cleanroom particle generation data for regulatory compliance