</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8461.50.40.50/NC Wafer Backside Grinder/Mexico

NC Wafer Backside Grinder from Mexico

Numerically controlled grinder removing backside material from semiconductor wafers to achieve target thickness post-processing. Classified HTS 8461.50.4050 as NC machine tool for cermet removal in wafer preparation per statistical notes. Critical for stress relief and TTV control.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify grind wheel composition (diamond/CBN) and thickness control specs (micron-level)

• Include wafer handling systems documentation confirming semiconductor compatibility

• Verify cleanroom particle generation data for regulatory compliance

NC Wafer Backside Grinder from Mexico — Import Duty Rate | HTS 8461.50.40.50