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8461.50.40.50/NC Wafer Backside Grinder/Japan

NC Wafer Backside Grinder from Japan

Numerically controlled grinder removing backside material from semiconductor wafers to achieve target thickness post-processing. Classified HTS 8461.50.4050 as NC machine tool for cermet removal in wafer preparation per statistical notes. Critical for stress relief and TTV control.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify grind wheel composition (diamond/CBN) and thickness control specs (micron-level)

• Include wafer handling systems documentation confirming semiconductor compatibility

• Verify cleanroom particle generation data for regulatory compliance