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8461.50.40.50/NC Wafer Backside Grinder/Germany

NC Wafer Backside Grinder from Germany

Numerically controlled grinder removing backside material from semiconductor wafers to achieve target thickness post-processing. Classified HTS 8461.50.4050 as NC machine tool for cermet removal in wafer preparation per statistical notes. Critical for stress relief and TTV control.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify grind wheel composition (diamond/CBN) and thickness control specs (micron-level)

• Include wafer handling systems documentation confirming semiconductor compatibility

• Verify cleanroom particle generation data for regulatory compliance

NC Wafer Backside Grinder from Germany — Import Duty Rate | HTS 8461.50.40.50