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8461.50.40.50/NC Wafer Backside Grinder/Canada

NC Wafer Backside Grinder from Canada

Numerically controlled grinder removing backside material from semiconductor wafers to achieve target thickness post-processing. Classified HTS 8461.50.4050 as NC machine tool for cermet removal in wafer preparation per statistical notes. Critical for stress relief and TTV control.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Specify grind wheel composition (diamond/CBN) and thickness control specs (micron-level)

• Include wafer handling systems documentation confirming semiconductor compatibility

• Verify cleanroom particle generation data for regulatory compliance