NC Float Zone Wafer Saw from Japan
Specialized numerically controlled saw for cutting wafers from float zone grown silicon boules used in power semiconductors. Falls under HTS 8461.50.4050 as NC cutting-off machine for semiconductor material per statistical notes on wafer slicing equipment. Handles high-purity crystals requiring minimal contamination.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify float zone method compatibility and resistivity range (1-1000 ohm-cm) in technical docs
• Include diamond wire specs and wire feed rates confirming semiconductor precision
• Ensure vacuum/controlled atmosphere capability is documented for classification support