NC Float Zone Wafer Saw from China
Specialized numerically controlled saw for cutting wafers from float zone grown silicon boules used in power semiconductors. Falls under HTS 8461.50.4050 as NC cutting-off machine for semiconductor material per statistical notes on wafer slicing equipment. Handles high-purity crystals requiring minimal contamination.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify float zone method compatibility and resistivity range (1-1000 ohm-cm) in technical docs
• Include diamond wire specs and wire feed rates confirming semiconductor precision
• Ensure vacuum/controlled atmosphere capability is documented for classification support