8461.50.40.50/CNC Wafer Slicing Saw/Japan

CNC Wafer Slicing Saw from Japan

A numerically controlled sawing machine designed to slice ultra-thin semiconductor wafers from monocrystalline silicon boules with precision tolerances. It falls under HTS 8461.50.4050 as a numerically controlled sawing machine for removing material from semiconductor materials, specifically in wafer preparation as per statistical notes for chapter 84. This equipment ensures minimal kerf loss and high yield in semiconductor manufacturing.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Verify numerical control certification and provide technical specs confirming use in semiconductor wafer slicing to avoid misclassification

• Include end-user statements specifying semiconductor manufacturing to qualify for potential duty exemptions or preferences

• Ensure compliance with export control regulations like EAR for high-precision saws used in advanced tech sectors

CNC Wafer Slicing Saw from Japan — Import Duty Rate | HTS 8461.50.40.50