CNC Wafer Edge Profiling Machine from China
Numerically controlled machine tool that profiles wafer edges to prevent chipping and ensure handling compatibility in fab processes. HTS 8461.50.4050 covers this NC sawing/cutting machine for semiconductor wafer preparation involving cermet/metal removal. Maintains critical edge geometry for subsequent processing steps.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include wafer size compatibility (200mm-450mm) and edge profile specs in import documentation
• Avoid classification as parts by importing complete functional units with control systems
• Document cleanroom compatibility (ISO Class 1-5) for potential preferential tariff treatment