CNC Silicon Ingot Cutting Saw from Japan
Numerically controlled multi-wire saw for slicing silicon ingots into brick sections prior to wafer slicing. HTS 8461.50.4050 covers NC sawing machines for semiconductor material processing. Uses diamond slurry wires for high-throughput brick production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document wire count (1000+), ingot size (up to 500kg), and slurry system specs
• Include throughput rates confirming semiconductor production scale
• Classify as complete machine, not wire supply system