CNC Silicon Ingot Cutting Saw from China
Numerically controlled multi-wire saw for slicing silicon ingots into brick sections prior to wafer slicing. HTS 8461.50.4050 covers NC sawing machines for semiconductor material processing. Uses diamond slurry wires for high-throughput brick production.
Duty Rate — China → United States
41.9%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document wire count (1000+), ingot size (up to 500kg), and slurry system specs
• Include throughput rates confirming semiconductor production scale
• Classify as complete machine, not wire supply system