8461.20.80/CNC Slotting Machine for Semiconductor Wafers/Japan

CNC Slotting Machine for Semiconductor Wafers from Japan

A precision CNC slotting machine designed to cut narrow slots and grooves into semiconductor wafers during fabrication preparation. It falls under HTS 8461.20.80 as a slotting machine working by removing metal or cermets (such as silicon wafers), specified as 'other' shaping or slotting machines. This equipment ensures exact tolerances critical for wafer processing prior to device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Verify machine specifications confirm slotting function for semiconductor materials to avoid misclassification into Chapter 90 testing apparatus

• Include detailed technical datasheets and end-use statements proving metal/cermet removal in import documentation

• Check for dual-use controls if machine handles sensitive materials like gallium arsenide; obtain necessary export licenses from origin country