8461.20.80/CNC Slotting Machine for Semiconductor Wafers/China

CNC Slotting Machine for Semiconductor Wafers from China

A precision CNC slotting machine designed to cut narrow slots and grooves into semiconductor wafers during fabrication preparation. It falls under HTS 8461.20.80 as a slotting machine working by removing metal or cermets (such as silicon wafers), specified as 'other' shaping or slotting machines. This equipment ensures exact tolerances critical for wafer processing prior to device fabrication.

Duty Rate — China → United States

39.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Verify machine specifications confirm slotting function for semiconductor materials to avoid misclassification into Chapter 90 testing apparatus

• Include detailed technical datasheets and end-use statements proving metal/cermet removal in import documentation

• Check for dual-use controls if machine handles sensitive materials like gallium arsenide; obtain necessary export licenses from origin country