High-Speed Wafer Polisher with In-Situ Cleaning from Mexico
Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify polishing pad types, pressure controls, and achievable roughness values in technical specs
• Document integration with fab cleanroom standards (ISO Class 1) to validate semiconductor use