High-Speed Wafer Polisher with In-Situ Cleaning from Japan
Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify polishing pad types, pressure controls, and achievable roughness values in technical specs
• Document integration with fab cleanroom standards (ISO Class 1) to validate semiconductor use