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8460.40.80.80/High-Speed Wafer Polisher with In-Situ Cleaning/Germany

High-Speed Wafer Polisher with In-Situ Cleaning from Germany

Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify polishing pad types, pressure controls, and achievable roughness values in technical specs

• Document integration with fab cleanroom standards (ISO Class 1) to validate semiconductor use

High-Speed Wafer Polisher with In-Situ Cleaning from Germany — Import Duty Rate | HTS 8460.40.80.80