High-Speed Wafer Polisher with In-Situ Cleaning from Canada
Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify polishing pad types, pressure controls, and achievable roughness values in technical specs
• Document integration with fab cleanroom standards (ISO Class 1) to validate semiconductor use