</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8460.40.80.80/High-Speed Wafer Polisher with In-Situ Cleaning/Canada

High-Speed Wafer Polisher with In-Situ Cleaning from Canada

Rotary polishing machine for final mirror finish on semiconductor wafers, incorporating brush cleaning stations. HTS 8460.40.80.80 for polishing machines finishing cermet/semiconductor surfaces using polishing products. Achieves surface roughness <0.5nm for advanced nodes.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify polishing pad types, pressure controls, and achievable roughness values in technical specs

• Document integration with fab cleanroom standards (ISO Class 1) to validate semiconductor use

High-Speed Wafer Polisher with In-Situ Cleaning from Canada — Import Duty Rate | HTS 8460.40.80.80