8460.40.80.80/Chemical Mechanical Planarization (CMP) Lapping Platform/Japan

Chemical Mechanical Planarization (CMP) Lapping Platform from Japan

CMP equipment using polishing pads and chemical slurries to planarize wafer surfaces during semiconductor fabrication. Though CMP-specific, classified under HTS 8460.40.80.80 as lapping/polishing machines for metal (silicon) finishing per statistical notes. Removes material layer-by-layer for multilayer chip construction.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Submit slurry composition analysis and removal rate data confirming material finishing function

• Distinguish from Chapter 90 by emphasizing mechanical polishing over metrology capabilities

Chemical Mechanical Planarization (CMP) Lapping Platform from Japan — Import Duty Rate | HTS 8460.40.80.80