Chemical Mechanical Planarization (CMP) Lapping Platform from Germany
CMP equipment using polishing pads and chemical slurries to planarize wafer surfaces during semiconductor fabrication. Though CMP-specific, classified under HTS 8460.40.80.80 as lapping/polishing machines for metal (silicon) finishing per statistical notes. Removes material layer-by-layer for multilayer chip construction.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Submit slurry composition analysis and removal rate data confirming material finishing function
• Distinguish from Chapter 90 by emphasizing mechanical polishing over metrology capabilities