Chemical Mechanical Planarization (CMP) Lapping Platform from China
CMP equipment using polishing pads and chemical slurries to planarize wafer surfaces during semiconductor fabrication. Though CMP-specific, classified under HTS 8460.40.80.80 as lapping/polishing machines for metal (silicon) finishing per statistical notes. Removes material layer-by-layer for multilayer chip construction.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit slurry composition analysis and removal rate data confirming material finishing function
• Distinguish from Chapter 90 by emphasizing mechanical polishing over metrology capabilities