Chemical Mechanical Planarization (CMP) Lapping Platform from Canada
CMP equipment using polishing pads and chemical slurries to planarize wafer surfaces during semiconductor fabrication. Though CMP-specific, classified under HTS 8460.40.80.80 as lapping/polishing machines for metal (silicon) finishing per statistical notes. Removes material layer-by-layer for multilayer chip construction.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit slurry composition analysis and removal rate data confirming material finishing function
• Distinguish from Chapter 90 by emphasizing mechanical polishing over metrology capabilities