Automated Wafer Honing System Model WH-3000 from Mexico
Precision honing machine that uses superabrasive tools to finish wafer edge profiles and chamfers, preventing micro-cracks during handling. HTS 8460.40.80.80 classification for honing machines finishing semiconductor metal surfaces other than gears. Essential for yield improvement in 300mm wafer fabs.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide edge profiling specifications (bevel angles, edge strength metrics) proving semiconductor application
• Include photos/videos demonstrating honing action on actual wafers in technical submission
• Avoid misclassification by excluding non-semiconductor demo workpieces from import samples