Automated Wafer Honing System Model WH-3000 from Mexico
Precision honing machine that uses superabrasive tools to finish wafer edge profiles and chamfers, preventing micro-cracks during handling. HTS 8460.40.80.80 classification for honing machines finishing semiconductor metal surfaces other than gears. Essential for yield improvement in 300mm wafer fabs.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide edge profiling specifications (bevel angles, edge strength metrics) proving semiconductor application
• Include photos/videos demonstrating honing action on actual wafers in technical submission
• Avoid misclassification by excluding non-semiconductor demo workpieces from import samples