8460.40.80.80/Automated Wafer Honing System Model WH-3000/Japan

Automated Wafer Honing System Model WH-3000 from Japan

Precision honing machine that uses superabrasive tools to finish wafer edge profiles and chamfers, preventing micro-cracks during handling. HTS 8460.40.80.80 classification for honing machines finishing semiconductor metal surfaces other than gears. Essential for yield improvement in 300mm wafer fabs.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide edge profiling specifications (bevel angles, edge strength metrics) proving semiconductor application

• Include photos/videos demonstrating honing action on actual wafers in technical submission

• Avoid misclassification by excluding non-semiconductor demo workpieces from import samples

Automated Wafer Honing System Model WH-3000 from Japan — Import Duty Rate | HTS 8460.40.80.80