Automated Wafer Honing System Model WH-3000 from China
Precision honing machine that uses superabrasive tools to finish wafer edge profiles and chamfers, preventing micro-cracks during handling. HTS 8460.40.80.80 classification for honing machines finishing semiconductor metal surfaces other than gears. Essential for yield improvement in 300mm wafer fabs.
Duty Rate — China → United States
39.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide edge profiling specifications (bevel angles, edge strength metrics) proving semiconductor application
• Include photos/videos demonstrating honing action on actual wafers in technical submission
• Avoid misclassification by excluding non-semiconductor demo workpieces from import samples