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8460.40.80.20/Small Flat Lapping Machine/Japan

Small Flat Lapping Machine from Japan

For flat semiconductor wafer lapping. HTS 8460.40.80.20.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Tolerance specs critical for classification

Small Flat Lapping Machine from Japan — Import Duty Rate | HTS 8460.40.80.20