8460.40.80.20/Small Flat Lapping Machine/Japan

Small Flat Lapping Machine from Japan

For flat semiconductor wafer lapping. HTS 8460.40.80.20.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Tolerance specs critical for classification

Small Flat Lapping Machine from Japan — Import Duty Rate | HTS 8460.40.80.20