Portable Semiconductor Wafer Polisher from Mexico
Lightweight polisher for final surface finishing of silicon wafers, achieving mirror-like flatness for device fabrication. HTS 8460.40.80.20 applies to low-value polishing machines using abrasives on cermet-like semiconductor materials. Aligns with statistical note for wafer grinders, lappers, polishers.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Label as 'for semiconductor wafers only' to prevent reclassification as general polishing machine
• Include abrasive polishing product compatibility in import docs for tariff verification
• Avoid bundling multiple units; each must qualify separately under value limit