Portable Semiconductor Wafer Polisher from Germany
Lightweight polisher for final surface finishing of silicon wafers, achieving mirror-like flatness for device fabrication. HTS 8460.40.80.20 applies to low-value polishing machines using abrasives on cermet-like semiconductor materials. Aligns with statistical note for wafer grinders, lappers, polishers.
Duty Rate — Germany → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Label as 'for semiconductor wafers only' to prevent reclassification as general polishing machine
• Include abrasive polishing product compatibility in import docs for tariff verification
• Avoid bundling multiple units; each must qualify separately under value limit