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8460.40.80.20/Mini Bore Honing Tool for Wafer Fixtures/Japan

Mini Bore Honing Tool for Wafer Fixtures from Japan

Precision honing machine for small bores in metal fixtures holding semiconductor wafers during processing. Low-value under HTS 8460.40.80.20 as other honing machines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Link to semiconductor end-use via fixture drawings

• Avoid 'gear honing' descriptors to stay out of 8461