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8460.40.80.20/Handheld Wafer Surface Lapper/Mexico

Handheld Wafer Surface Lapper from Mexico

Portable lapper for spot finishing semiconductor wafer surfaces post-slicing. Fits low-value polishing/lapping under 8460.40.80.20.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Classify as machine, not hand tool (8205)

Handheld Wafer Surface Lapper from Mexico — Import Duty Rate | HTS 8460.40.80.20