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8460.40.80.20/Handheld Wafer Surface Lapper/Mexico

Handheld Wafer Surface Lapper from Mexico

Portable lapper for spot finishing semiconductor wafer surfaces post-slicing. Fits low-value polishing/lapping under 8460.40.80.20.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Classify as machine, not hand tool (8205)