8460.40.80.20/Handheld Wafer Surface Lapper/Japan

Handheld Wafer Surface Lapper from Japan

Portable lapper for spot finishing semiconductor wafer surfaces post-slicing. Fits low-value polishing/lapping under 8460.40.80.20.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Classify as machine, not hand tool (8205)