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8460.40.80.20/Handheld Wafer Surface Lapper/Germany

Handheld Wafer Surface Lapper from Germany

Portable lapper for spot finishing semiconductor wafer surfaces post-slicing. Fits low-value polishing/lapping under 8460.40.80.20.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Classify as machine, not hand tool (8205)

Handheld Wafer Surface Lapper from Germany — Import Duty Rate | HTS 8460.40.80.20